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Showing posts with label Flash memory. Show all posts
Showing posts with label Flash memory. Show all posts

From magnetic to solid state, spin-free: What a long, strange storage trip it’s turning out to be

Flash-memory-based solid-state drives have recently stirred up the staid storage industry, and their initial success stories foretell a potentially stellar future. Consider, for example, how rapidly they’ve taken over the formerly robust market for 1.8-in. hard-disk drives. Also consider their significant influence on smaller-form-factor hard-disk drives’ lackluster initial unveilings. A notable percentage of netbook, tablet, and other alternative mobile computers, especially those running Linux operating-system variants, contain solid-state drives instead of hard-disk drives. Thin and light conventional notebook PCs running Windows and OS X are also well along the conversion path.

Enterprise-computing applications might at first glance seem to be poor candidates for solid-state technology, given its substantially higher cost than the magnetic alternative at the high capacities that this market segment requires. Yet, by virtue of its low energy consumption, increased reliability, and ultrafast read rates, the technology is making notable progress in conquering the corporate world. Consider that, to maximize hard drives’ performance, IT departments have long formatted only the platters’ fastest-access portion, wasting the rest of the drive and thereby blunting the argument that hard drives cost less than their nonmagnetic counterparts. Consider, too, that a number of applications, including smartphones, PDAs (personal digital assistants), digital still cameras, and videocameras, that might have formerly gone with—and, in some cases, in initial product generations, did go with—hard drives have migrated en masse to solid-state storage.

Proponents of both approaches dispute the extent of solid-state technology’s potential to obsolete its predecessor, and the industry has yet to determine a winner. These debates illustrate a number of fundamental misrepresentations of solid-state drives’ strengths and shortcomings. EDN readers’ feedback to past editorial coverage reveals similar misunderstanding (Reference 1). This article attempts to clear up at least some of that confusion.

Cost, power consumption, and any other all-important comparative factors aside, the differences between hard-disk and solid-state drives boil down to a few fundamental points. First, solid-state drives, especially those in applications with random-access patterns, read data substantially faster than hard drives can, 

assuming the absence of any storage-to-system-interface bottlenecks. In contrast, solid-state drives, especially those in applications with random-access patterns, write data much slower than hard drives do. Also, once the solid-state drive has depleted its inventory of spare capacity, block-erase delays become a larger percentage of the total write latency. Further, unlike with a hard-disk drive, flash memory is not fully bit-alterable. Although flash memory can change ones to zeros on a bit-by-bit basis, converting even a single zero back into a one requires erasing the entire block containing the bit.

Another difference is that flash memory eventually “wears out” after extended erase cycles. However, it tends to do so on a block-by-block basis and in a predictable manner that the media controller can easily detect far in advance and compensate for in a variety of ways. Many hard-drive failures, in contrast, are abrupt and systemic. Further, because solid-state drives are semiconductor-based, they are notably more immune to the effects of abrupt shock, sustained vibration, and other types of jarring. They’re also comparatively impervious to environmental interference, such as from magnetic fields.

Most of today’s flash memory uses a conceptually common floating-gate cell structure (Figure 1). Fast-random-read-access NOR and slower—albeit less expensive on a per-bit basis—NAND technologies differ predominantly in their cell-to-cell interconnect schemes. In its default erased state, the transistor turns on—that is, outputs a one—when the memory device’s integrated address-decoding circuitry activates the necessary array row and column lines to select it. With the transistor programmed by means of additional electrons stored on its floating gate, it cannot turn on when address inputs select it and therefore outputs a zero to read attempts.


Figure 1: Most single-transistor flash-memory cells operate in a conceptually similar fashion (a) regardless of whether they interconnect in a NOR (b) or a NAND (c) scheme. Bit-by-bit or more efficient page-by-page programming places incremental charge on the floating gate (d), thereby counteracting an applied turn-on voltage during subsequent reads. Block-by-block erasure (e) removes this charge surplus (courtesy the Wikipedia Foundation).

Altering the stored value of a flash-memory transistor involves the application of higher-than-normal voltages to various transistor junctions, thereby creating the necessary electric fields to affect electron flow onto or off the floating gate. Initial flash-memory generations required off-chip generation of these voltages; nowadays, most devices employ on-die high-voltage pumps for this function. Theoretically, you could alter a transistor’s value—both for one-to-zero programming and for zero-to-one erasure—on a bit-by-bit basis, as is the case with EEPROMs (electrically erasable programmable read-only memories), FRAMs (ferroelectric random-access memories), MRAMs (magnetic RAMs), and battery-backed SRAMs (static RAMs). The necessary signal-routing, isolation, and other circuitry, however, would use too much die area and would therefore be too expensive at the IC capacities that bulk-storage applications require.

With modern NAND flash memory, on the other hand, you can erase blocks in approximately 512-kbyte increments. Bit-by-bit programming is possible; from an efficiency standpoint, however, solid-state drives and the NAND chips within them prefer to write data in approximately 4-kbyte chunks. This preference reflects the cost-versus-performance sizes of the RAM buffers on the flash-memory die. The bulk-alteration requirement differentiates flash memory not only from other nonvolatile semiconductor-storage technologies but also from hard-disk drives. The repeated electron flow across the thin silicon layer between the flash-memory transistor’s substrate and floating gate and through incremental program and erase cycles stresses the oxide. At first, electrons inadvertently become trapped in the oxide lattice, impeding the flow of other electrons and slowing subsequent program and erase operations. Eventually, the oxide breaks down by rupturing, for example, leading to fundamental transistor failure. This demise tends to disrupt the function of the entire erase block that contains the affected transistor.

Modern flash memories come in both SLC (single-level-cell) and MLC (multilevel-cell) variants; today’s MLC variants are primarily 2-bit-per-cell devices (Figure 2). With SLC flash memories, the voltage-sensing circuitry that connects to the array transistors’ outputs can be relatively simple because it needs to discern only one voltage threshold and because the transistor’s one and zero output voltages have substantial margin to this threshold. However, with a 2-bit-per-cell MLC flash memory, three voltage thresholds—that is, four levels—require discernment during reads. The programming operation for placing the necessary amount of electron charge onto the transistor’s floating gate is similarly precise, and the effects of supply-voltage and operating-temperature variation and cycling further complicate this operation. Spansion claims that its MirrorBit MLC technology approach somewhat reduces the need for precise electron placement. Nonetheless, the concept remains largely relevant.


Figure 2: Whereas conventional 1-bit-per-cell flash memory has plenty of margin within the threshold-voltage envelope between a sensed zero and a sensed one (a), 2-, 3-, and 4-bit-per-cell technologies are more challenging to reliably implement across supply- voltage, temperature, and erase-cycling ranges (b) (courtesy Micron Technology).

It’s probably no surprise that MLC reads and writes—that is, program=—are substantially slower than their SLC counterparts and that the maximum block-cycling specifications for MLC memories are on average an order of magnitude less than those of SLC chips. These fundamental trade-offs are necessary for obtaining a lower per-bit cost for MLC storage devices (Table 1).


Now, consider Intel and Micron Technology’s new 3-bit-per-cell memories and that Sandisk recently began producing 4-bit-per-cell X4 devices (Reference 2). The difference between any two sequential voltage levels and, hence, decoded-bit combinations with these new devices is on the order of 100 or so electrons or fewer in some cases. This situation represents a profound challenge for semiconductor-process and -product engineers. By potentially hampering both performance and data dependability, it calls into question the chips’ suitability for applications requiring highly reliable storage. Then again, folks not too long ago were saying the same thing about 2-bit-per-cell MLC flash memory.


Controller choices

The media controller may be a hardware-centric device, a software-fueled CPU, or any combination thereof. The hardware-versus-software choice of a controller involves trading off cost, performance, and power consumption versus flexibility and the ability to upgrade. Whatever its composition, the media controller acts as a bridge between the flash memories and the conventional hardware and software interfaces that the CPU, core-logic chip set, and other subsystems expect. The controller also manages the data stored in the single-component or multicomponent merged flash-memory array to avoid “hot-spot” overcycling of any erase blocks in the array, ideally as a background function that is invisible to the host both in access time and in any other regard. The controller leverages flash memory’s strengths and mitigates its read- and write-speed weaknesses. The result is, with any luck, at least on par with—and, ideally, much faster than—the hard-drive alternative.

One perhaps obvious way of boosting effective solid-state-drive performance at the expense of incurring higher power consumption is to access multiple components in parallel using several address-, data-, and control-line channels between the controller and the flash memories. You can then not only simultaneously read, program, or erase multiple array elements, but also juggle multiple operations with different ICs. For example, you could read from one while writing or erasing another if the system’s access profiles justify this added level of controller complexity. In choosing a multichannel scheme, however, you also multiply the granularity of the solid-state drive’s capacity and the effective sizes of program pages and erase blocks. This situation might warrant the choice of a flexible controller design that can run in either single-channel or multichannel mode.

Modern flash memories exhibit significant disparities between program-page and erase-block sizes and between program and erase times. The controller should, therefore, manage the media in such a way that background-erase operations for wear-leveling purposes—which manufacturers also commonly call housekeeping, garbage collection, and merging—on a component or a block within that component don’t collide with system-write-request-initiated foreground programming operations on that same component or block or, for that matter, foreground system-read requests. Embedding a large RAM cache on the solid-state drive, much like the buffers on modern hard drives, can also be an effective collaborator to system-side buffering in mitigating any perceived decrease in performance that these housekeeping tasks incur. The trade-off of this approach, however, is that it requires more parts.

Reads and writes were traditionally the only required storage functions because, unlike with flash memory, you could fully overwrite hard-drive media on a bit-by-bit basis. A file-deletion request causes the file system to update its internal tables accordingly, but it historically didn’t pass that information to the drive. Hence, the solid-state-drive controller is unaware that it can do background cleanup to free up the relevant pages and blocks containing them for future writes. The necessary erase and program operations occur only after the file system requests an explicit overwrite of the LBAs (logical-block addresses) associated with the drive’s now-invalid PBAs (physical-block addresses). These operations are then unfortunately in the foreground where they adversely affect perceived read and write speed.

Manufacturers typically ship solid-state drives from the factory with spare “fresh” capacity, which is invisible to the operating system. The controller uses this capacity to delay the inevitable onset of the noted performance-strapping scenarios. However, good news is on the way in the form of the “trim” command, which the T13 Technical Committee of the INCITS (International Committee for Information Technology Standards) is now standardizing as part of the ATA (advanced-technology-attachment) command set. At press time, the T10 Technical Committee had not yet revealed its plans for the SCSI (small-computer-system-interface) command set. Before a system uses the trim command, it interrogates the drive to determine rotation speed. If it encounters a 0-rpm response, the system assumes that it is dealing with a solid-state disk and does further queries to determine whether trim support exists along with other relevant parameters. The trim command informs the drive that pages stored within the array are no longer valid and are therefore candidates for housekeeping. Deletion of a file within a trim-cognizant operating system results in the sending of relevant information for the corresponding LBAs to the drive’s controller.

Although the trim command can dramatically improve sustained solid-state-drive performance in applications requiring many file deletions, it’s ineffective in cases in which file updates occur, such as when you open a document for editing and then save the updated version or with Microsoft Outlook’s PST database format. More generally, it exposes the weakness inherent in the strong linkage between LBAs and PBAs in FFSs (flash file systems). Sandisk’s venerable FFS, along with the FTL (flash-translation-layer) technology the company obtained when it acquired M-Systems in mid-2006, strives to provide PBA independence for frequently updated files, such as the Windows Registry and the FAT (file-allocation table).

The company unveiled its ExtremeFFS at January’s CES (Consumer Electronics Show) and both implements it in its products and makes it available for licensing. ExtremeFFS further severs explicit LBA-to-PBA linkage, thereby claiming to boost random write speeds by a factor as great as 100 times. ExtremeFFS makes less efficient use of the flash-memory media to accomplish this objective; Sandisk declines to provide specifics. Given the burgeoning capacities available with lithographies such as Intel and Micron’s latest 34-nm process, however, the incremental ExtremeFFS overhead will over time become less of a practical issue.


System optimizations

Solid-state units are currently shoehorning themselves into legacy hard-drive designs to leverage that technology’s huge market, thereby jump-starting the solid-state-storage ramp-up (Figure 3). But as solid-state drives become more prevalent and presumably, therefore, a from-the-start implementation choice, a carefully crafted software/hardware implementation can optimally benefit from flash memory’s unique capabilities. Consider, for example, common file-system operations, such as periodic automatic disk defragmentation, prefetching, file-location optimization, and system-side caching. These features all aim to compensate for hard drives’ head-relocation and platter-rotation latencies, which cause slow random read accesses. Neither of these latencies is a factor with solid-state drives. Eliminating such workarounds can consequently improve system cost, power consumption, and other key variables and can reduce flash-media cycling.


Figure 3: Most of today’s solid-state drives, such as Intel’s X25 units, use conventional storage interfaces and will benefit from those interfaces’ evolutionary performance improvements (a). More revolutionary approaches migrate to alternative system interfaces with closer proximity to the CPU, such as Fusion-io’s approach with PCIe (b) and Spansion’s approach with DRAM (c).

Microsoft’s latest Windows 7 operating system makes such adjustments when it detects a solid-state drive’s presence in a system using the same scheme it uses for assessing trim support (Reference 2). Trim cognizance extends beyond simple file-deletion operations to encompass the full range of related functions, such as partition formats and system snapshots. Avoiding random-location writes whenever possible to boost performance can benefit both hard-disk- and solid-state-drive technologies. Integrated file-compression support for flash-memory-housed data can reduce the per-bit cost gap between the technologies. Windows 7 and its peers also are more scrupulous about, for example, ensuring that partition- and file-location endpoints align with—rather than overlap—flash memory’s write-page boundaries. And solid-state drives may provide an opportunity to reduce the system DRAM’s budget requirement to less than it was in the hard-drive-centric past, thanks to solid-state’s fast-access—at least for reads—virtual-memory-paging scheme.

System-hardware interfaces provide another opportunity for optimization. Except perhaps with extremely high-rotations-per-minute, enterprise-tailored units, hard drives tap the bandwidth capability of modern storage interfaces, such as 3-Gbps SATA (serial ATA) and SAS (serial attached SCSI), only when doing transfers to and from the drive’s RAM buffer. Solid-state drives conversely can make more meaningful use of the performance potential of SATA and SAS, and the two technologies’ performance gap will only increase in the upcoming 6-Gbps serial-storage-interface generation (Reference 3 and Reference 4). Similar disparities are likely with the upcoming 4.8-Gbps USB (Universal Serial Bus) Version 3 and with Intel’s embryonic Light Peak optical-interface technology.

But why restrict yourself to a legacy storage interface at all? Companies such as Fusion-io have figured out that PCIe (Peripheral Component Interconnect Express)-based add-in cards can boost performance by moving the solid-state drive closer to the CPU with which it’s interacting. Giving the flash memory, either on a module or directly attached to the system board, a dedicated interface to the chip set affords an even closer linkage. Intel uses this approach with its Turbo memory cache, for example. The approach incurs a trade-off, however, in that it makes it more difficult for the end user to later alter the system-memory allocation. Alternatively, you can use the DRAM bus, as Intel’s 28F016XD flash memory attempted to do in the mid-1990s and as Spansion’s EcoRAM does today. In such a configuration, you might even be able to dispense with a dedicated flash-memory-controller chip, instead employing software running on the host CPU or circuitry within the chip set’s logic.
Author Information
By Brian Dipert, Senior Technical Editor, EDN
You can reach Senior Technical Editor Brian Dipert at 1-916-760-0159, bdipert@edn.com, and www.bdipert.com

References
1. Dipert, Brian, “Solid-state drives challenge hard disks,” EDN, Nov 13, 2008, pg 25.
2. “Engineering Windows 7,” Microsoft Corp, 2009.
3. Dipert, Brian, “Speedy simplicity: serial-storage interfaces,” EDN, Jan 22, 2004, pg 33, .
4. Dipert, Brian: “Interface overkill? Is eSATA necessary for your next system design?” EDN, May 10, 2007, pg 48.

Timeline: Mobile storage


Today, people can carry several gigabytes of data in their pockets. However, pen drives are still a relatively new medium, and their forefathers have been around for a while.


Methods of transporting data have been in existence right from the beginning of civilization; important information was scribbled on clay tablets or papyrus for preservation or transmission. But the fi rst real digital storage medium was the punch card: Herman Hollerith (1860– 1929), the son of a German immigrant, worked as a statistician for the American government and designed a system that could process punch card system. It was used for storing the census data of the year 1890–91. 



In 1896, Hollerith founded the Tabulating Machine Company, which after merging with two other companies, became what we now know as International Business Machines—IBM. The punch card further developed into the punch tape: even Konrad Zuse, inventor of the modern programmable computer, used these to feed his pioneering Z1 with data. But subsequently, the development of data storage and media stagnated for as long as 30 years.

Then, magnetic media started dominating the storage world. These were originally meant for audio recordings, but an IBM research group lead by Alan Shugart designed the fi rst fl oppy disk in 1969. It was impressively large at eight inches, and also enormous in storage capacity for the time: it could store 80 KB of data—as much as 1,000 punch cards.

Over the years, fl oppy disks continued to decrease in size and increase in data capacity. Then, in 1983, SyQuest brought the fi rst removable hard disk into the market. You could save a sensational 5 MB on it and simply store it on a shelf. Later, Japanese fi rm Taiyo Yuden achieved great success in 1989 by introducing the recordable CD. Magnetooptical technology—a combination of magnetic discs and lasers—off ered considerably better data security at the time, but could not compete with CD-Rs. 

























The storage revolution of 1996: Dov Moran invents the USB stick 


American manufacturer Iomega began to sell Zip disks and drives in 1994. The 100 MB units were poised to become the dominant removable storage format of the time, superseding even the universally accepted 3.5 inch fl oppy disk after 13 years, but Iomega missed the chance because of reliability problems.

In 1996, somebody else grabbed this opportunity: Dov Moran, the founder of the fi rm M-Systems, came upon the idea of designing a Flash component with a USB connection. He called his new 8 MB memory device DiskOnKey—the fi rst USB pen drive—which was sold by IBM in America. But research continued, and the SD card that was introduced in 1999 revolutionized the digital world once again. Iomega tried to bring another innovative product to the market in 2003 with its Rev removable hard disk standard—but once again failed to gain enough traction. Only CD-R, DVD-R (plus or minus) and the USB stick are still present in the consumer world today. Blu-ray wants to penetrate the market, but is not exactly aff ordable just yet. 

The only other contender is the external hard disk, usually a USB-enabled version of the hard disk we are all familiar with. These are available in multiple capacities and with newer connectivity options, and demand is growing thanks to ever-falling prices. The Flash and hard drives will be around  for a while, but USB might make way for faster connection options.

























NAND vs. NOR

Introduction

Flash memory has become a powerful and cost-effective solid-state storage technology widely used in mobile electronics devices and other consumer applications. Two major forms of Flash memory, NAND Flash and NOR Flash, have emerged as the dominant varieties of non-volatile semiconductor memories utilized in portable electronics devices. NAND Flash, which was designed with a very small cell size to enable a low cost-per-bit of stored data, has been used primarily as a high-density data storage medium for consumer devices such as digital still cameras and USB solid-state disk drives. NOR Flash has typically been used for code storage and direct execution in portable electronics devices, such as cellular phones and PDAs.

Recently, however, the distinction between the two types of Flash memory has become less clear. New cell phone controllers that support NAND Flash as an alternative to or an addition to NOR Flash have helped make NAND a viable alternative for a broader array of applications. In addition, data storage capacity and performance requirements in cell phones have increased significantly with the growth of feature-rich phones that incorporate camera, music, video, gaming and other functionality. NAND Flash has become an attractive alternative for the data storage aspects of todayís cell phones because of its higher speed write and erase performance as well as its low cost-per-bit. As a result, designers of memory subsystems in portable electronics are now using NAND in some traditional NOR-based applications. For todayís full-featured cell phones, many designers are utilizing memory architectures that combine NOR with NAND for data storage, or are using NAND as the primary Flash memory in combination with low power DRAM in which the program code can be shadowed and run. In either case, the different types of memory are frequently stacked in Multi-Chip Packages (MCP) to create a single component


This overview will briefly discuss the history of Flash memory development, compare and contrast NAND and NOR Flash memory, and discuss the ways in which the two technologies are used today

Figure 1 below provides a summary of how NAND and NOR Flash vary for a number of important design characteristics: capacity, read speed, write speed, active and standby power consumption, cost-per-bit, and ease of use for file storage and code storage applications.


The History of Flash Memory

As a recognized pioneer in flash technology, Toshiba was a principal innovator of both NOR-type and NAND-type Flash technology in the 1980ís. These new memories were developed to address the need for a non-volatile memory that is easily reprogrammable within a system. Some kind of non-volatile memory is necessary for computing systems so that the system does not erase all data every time it is powered down, or following a power failure. Both NOR and NAND Flash systems are electrically erasable solutions, and can write and erase data many times, but do not lose stored data when the power is turned off.

NAND and NOR Flash Memory Architecture

In the internal circuit configuration of NOR Flash, the individual memory cells are connected in parallel, which enables the device to achieve random access. This configuration enables the short read times required for the random access of microprocessor instructions. NOR Flash is ideal for lower-density, high-speed read applications, which are mostly read only, often referred to as code-storage applications.

NAND Flash was developed as an alternative optimized for high-density data storage, giving up random access capability in a tradeoff to achieve a smaller cell size, which translates to a smaller chip size and lower cost-per-bit. This was achieved by creating an array of eight memory transistors connected in a series. Utilizing the NAND Flash architectureís high storage density and smaller cell size, NAND Flash systems enable faster write and erase by programming blocks of data. NAND Flash is ideal for low-cost, high-density, high-speed program/erase applications, often referred to as data-storage applications.

NOR vs. NAND Flash Density

For any given lithography process, the density of the NAND Flash memory array will always be higher than NOR Flash. In theory, the highest density NAND will be at least twice the density of NOR, for the same process technology and chip size. In reality, market forces determine the highest density that will be commercially produced. Today, comparing only single chip memory with one bit per cell (also called Single Level Cell, or SLC), the highest density NOR commercially available is 256 megabit (Mb), while NAND is available in densities of 4 gigabit (Gb). Because cost-per-bit, which is closely related to the silicon real estate required, is one of the most important characteristics of memory, the small cell size characteristic of NAND Flash is a significant factor.

Choosing NAND vs. NOR

When should one choose NAND Flash over NOR Flash? The answer depends on the system requirements. Figure 4 below compares NAND Flash with asynchronous NOR Flash in terms of various operating and performance characteristics:

The characteristics of NAND Flash are: high density, medium read speed, high write speed, high erase speed, and an indirect or I/O like access. The characteristics of NOR Flash are lower density, high read speed, slow write speed, slow erase speed, and a random access interface.

For a system that needs to boot out of Flash, execute code from the Flash, or if read latency is an issue, NOR Flash may be the answer. However, for storage applications, NAND Flashís higher density, and high programming and erase speeds make it the best choice. While the benefit of high programming speed in high-density Flash devices is obvious, erase performance is equally important, though less obvious. Unlike magnetic memory systems (hard disk drives and tape drives), Flash memory requires a separate erasing step in order to turn all bits back to the ì1î state before the device is programmed.

Power is another important concern for many applications. For any write-intensive applications, NAND Flash will consume significantly less power. Although the instantaneous power (voltage current) figures between NOR Flash and NAND Flash appear comparable, total energy will be significantly higher for NOR Flash since energy = power * time.

When a system, such as a camera phone, has a requirement both for code execution and high capacity data storage, designers may need to consider alternatives and tradeoffs, such as using both types of Flash memory, possibly in combination with Pseudo Static RAM (PSRAM), or using NAND as the Flash memory in combination with low power DRAM in which to run the operating code. The best Flash memory to choose will be the one that offers the required performance and density at the lowest cost.

Reference

http://www.chips.toshiba.com

Flash Memory

Flash memory is non-volatile computer memory that can be electrically erased and reprogrammed. It is a technology that is primarily used in memory cards and USB flash drives for general storage and transfer of data between computers and other digital products. It is a specific type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that is erased and programmed in large blocks; in early flash the entire chip had to be erased at once. Flash memory costs far less than byte-programmable EEPROM and therefore has become the dominant technology wherever a significant amount of non-volatile, solid-state storage is needed. Example applications include PDAs (personal digital assistants), laptop computers, digital audio players, digital cameras and mobile phones. It has also gained popularity in the game console market, where it is often used instead of EEPROMs or battery-powered SRAM for game save data.Flash memory is non-volatile, which means that no power is needed to maintain the information stored in the chip. In addition, flash memory offers fast read access times (although not as fast as volatile DRAM memory used for main memory in PCs) and better kinetic shock resistance than hard disks. These characteristics explain the popularity of flash memory in portable devices. Another feature of flash memory is that when packaged in a "memory card," it is enormously durable, being able to withstand intense pressure, extremes of temperature, and even immersion in water.Although technically a type of EEPROM, the term "EEPROM" is generally used to refer specifically to non-flash EEPROM which is erasable in small blocks, typically bytes. Because erase cycles are slow, the large block sizes used in flash memory erasing give it a significant speed advantage over old-style EEPROM when writing large amounts of data.

Principles of operation

Flash memory stores information in an array of memory cells made from floating-gate transistors. In traditional single-level cell (SLC) devices, each cell stores only one bit of information. Some newer flash memory, known as multi-level cell (MLC) devices, can store more than one bit per cell by choosing between multiple levels of electrical charge to apply to the floating gates of its cells.

NOR flash

In NOR gate flash, each cell resembles a standard MOSFET, except the transistor has two gates instead of one. On top is the control gate (CG), as in other MOS transistors, but below this there is a floating gate (FG) insulated all around by an oxide layer. The FG is interposed between the CG and the MOSFET channel. Because the FG is electrically isolated by its insulating layer, any electrons placed on it are trapped there and, under normal conditions, will not discharge for many years. When the FG holds a charge, it screens (partially cancels) the electric field from the CG, which modifies the threshold voltage (VT) of the cell. During read-out, avoltage is applied to the CG, and the MOSFET channel will become conducting or remain insulating, depending on the VT of the cell, which is in turn controlled by charge on the FG. The current flow through the MOSFET channel is sensed and forms a binary code, reproducing the stored data. In a multi-level cell device, which stores more than one bit per cell, the amount of current flow is sensed (rather than simply its presence or absence), in order to determine more precisely the level of charge on the FG.A single-level NOR flash cell in its default state is logically equivalent to a binary "1" value, because current will flow through the channel under application of an appropriate voltage to the control gate. A NOR flash cell can be programmed, or set to a binary "0" value, by the following procedure:an elevated on-voltage (typically >5 V) is applied to the CG the channel is now turned on, so electrons can flow from the source to the drain (assuming an NMOS transistor) the source-drain current is sufficiently high to cause some high energy electrons to jump through the insulating layer onto the FG, via a process called hot-electron injection



To erase a NOR flash cell (resetting it to the "1" state), a large voltage of the opposite polarity is applied between the CG and source, pulling the electrons off the FG through quantum tunneling. Modern NOR flash memory chips are divided into erase segments (often called blocks or sectors). The erase operation can only be performed on a block-wise basis; all the cells in an erase segment must be erased together. Programming of NOR cells, however, can generally be performed one byte or word at a time.Despite the need for high programming and erasing voltages, virtually all flash chips today require only a single supply voltage, and produce the high voltages via on-chip charge pumps

Fig: NOR flash memory wiring and structure on silicon
NAND flash

NAND gate flash uses tunnel injection for writing and tunnel release for erasing. NAND flash memory forms the core of the removable USB storage devices known as USB flash drives, as well as most memory cardformats available today.

Fig: NAND flash memory wiring and structure on silicon
Limitations of Flash memory

Block erasure:- One limitation of flash memory is that although it can be read or programmed a byte or a word at a time in a random access fashion, it must be erased a "block" at a time. This generally sets all bits in the block to 1. Starting with a freshly erased block, any location within that block can be programmed. However, once a bit has been set to 0, only by erasing the entire block can it be changed back to 1. In other words, flash memory (specifically NOR flash) offers random-access read and programming operations, but cannot offer arbitrary random-access rewrite or erase operations. A location can, however, be rewritten as long as the new value's 0 bits are a superset of the over-written value's. For example, a nibble value may be erased to 1111, then written as 1110. Successive writes to that nibble can change it to 1010, then 0010, and finally 0000. In practice few algorithms can take advantage of this successive write capability and in general the entire block is erased and rewritten at once.Although data structures in flash memory cannot be updated in completely general ways, this allows members to be "removed" by marking them as invalid. This technique must be modified somewhat for multi-level devices, where one memory cell holds more than one bit.

Memory wear:- Another limitation is that flash memory has a finite number of erase-write cycles. Most commercially available flash products are guaranteed to withstand around 100 000 write-erase-cycles (see citations under Endurance, below). The guaranteed cycle count may apply only to block zero (as is the case with TSOP NAND parts), or to all blocks (as in NOR). This effect is partially offset in some chip firmware or file system drivers by counting the writes and dynamically remapping blocks in order to spread write operations between sectors; this technique is called wear levelling. Another approach is to perform write verification and remapping to spare sectors in case of write failure, a technique called bad block management (BBM). For portable consumer devices, these wearout management techniques typically extend the life of the flash memory beyond the life of the device itself, and some data loss may be acceptable in these applications. For high reliability data storage, however, it is not advisable to use flash memory that has been through a large number of programming cycles. This limitation does not apply to 'read-only' applications such as thin clients and routers, which are only programmed once or at most a few times during their lifetime.

Distinction between NOR and NAND flash

NOR and NAND flash differ in two important ways:
  • the connections of the individual memory cells are different
  • the interface provided for reading and writing the memory is different (NOR allows random-access for reading, NAND allows only page access)

It is important to understand that these two are linked by the design choices made in the development of NAND flash. An important goal of NAND flash development was to reduce the chip area required to implement a given capacity of flash memory, and thereby to reduce cost per bit and increase maximum chip capacity so that flash memory could compete with magnetic storage devices like hard disks.NOR and NAND flash get their names from the structure of the interconnections between memory cells.[10] In NOR flash, cells are connected in parallel to the bit lines, allowing cells to be read and programmed individually. The parallel connection of cells resembles the parallel connection of transistors in a CMOS NOR gate. In NAND flash, cells are connected in series, resembling a NAND gate, and preventing cells from being read and programmed individually: the cells connected in series must be read in series.When NOR flash was developed, it was envisioned as a more economical and conveniently rewritable ROM than contemporary EPROM,EAROM, and EEPROM memories. Thus random-access reading circuitry was necessary. However, it was expected that NOR flash ROM would be read much more often than written, so the write circuitry included was fairly slow and could only erase in a block-wise fashion; random-access write circuitry would add to the complexity and cost unnecessarily.Because of the series connection and removal of wordline contacts, a large grid of NAND flash memory cells will occupy perhaps only 60% of the area of equivalent NOR cells[11] (assuming the same CMOS process resolution, e.g. 130 nm, 90 nm, 65 nm). NAND flash's designers realized that the area of a NAND chip, and thus the cost, could be further reduced by removing the external address and data bus circuitry. Instead, external devices could communicate with NAND flash via sequential-accessed command and data registers, which would internally retrieve and output the necessary data. This design choice made random-access of NAND flash memory impossible, but the goal of NAND flash was to replace hard disks, not to replace ROMs.

Applications

Serial flash:- Serial flash is a small, low-power flash memory that uses a serial interface, typically SPI, for sequential data access. When incorporated into an embedded system, serial flash requires fewer wires on the PCB than parallel flash memories, since it transmits and receives data one bit at a time. This may permit a reduction in board space, power consumption, and total system cost.
There are several reasons why a serial device, with fewer external pins than a parallel device, can significantly reduce overall cost:
  • Many ASICs are pad-limited, meaning that the size of the die is constrained by the number of wire bond pads, rather than the complexity and number of gates used for the device logic. Eliminating bond pads thus permits a more compact integrated circuit, on a smaller die; this increases the number of dies that may be fabricated on a wafer, and thus reduces the cost per die.
  • Reducing the number of external pins also reduces assembly and packaging costs. A serial device may be packaged in a smaller and simpler package than a parallel device.
  • Smaller and lower pin-count packages occupy reduced PCB area.
  • Lower pin-count devices simplify PCB routing.


Firmware storage:- With the increasing speed of modern CPUs, parallel flash devices are often too slow to execute in place program code stored on them. Conversely, modern SRAM offers access times below 10 ns, while DDR2 SDRAM offers access times below 20 ns. Because of this, it is often necessary to shadow code stored in flash into RAM; that is, code must be copied from flash into RAM before execution, so that the CPU may access it at full speed. Device firmware may be stored in a serial flash device, and then copied into SDRAM or SRAM when the device is powered-up. Using an external serial flash device rather than on-chip flash removes the need for significant process compromise (a process that is good for high speed logic is generally not good for flash and vice-versa). Once it is decided to read the firmware in as one big block it is common to add compression to allow a smaller flash chip to be used. Typical applications for serial flash include storing firmware for hard drives, Ethernet controllers, DSL modems, wireless network devices, etc.

Flash memory as a replacement for hard drives:- An obvious extension of flash memory would be as a replacement for hard disks. Flash memory does not have the mechanical limitations and latencies of hard drives, so the idea of a solid-state drive, or SSD, is attractive when considering speed, noise, power consumption, and reliability.There remain some aspects of flash-based SSDs that make the idea unattractive. Most important, the cost per gigabyte of flash memory remains significantly higher than that of platter-based hard drives. Although this ratio is decreasing rapidly for flash memory, it is not yet clear that flash memory will catch up to the capacities and affordability offered by platter-based storage. Still, research and development is sufficiently vigorous that it is not clear that it will not happen, eitherThere is also some concern that the finite number of erase/write cycles of flash memory would render flash memory unable to support an operating system. This seems to be a decreasing issue as warranties on flash-based SSDs are approaching those of current hard drives.As of May 24, 2006, South Korean consumer-electronics manufacturer Samsung Electronics had released the first flash-memory based PCs, the Q1-SSD and Q30-SSD, both of which have 32 GB SSDs. Dell Computer introduced the Latitude D430 laptop with 32 GB flash-memory storage in July 2007 -- at a price significantly above a hard-drive equipped versionAt the Las Vegas CES 2007 Summit Taiwanese memory company A-DATA showcased SSD hard disk drives based on Flash technology in capacities of 32 GB, 64 GB and 128 GB.[21] Sandisk announced an OEM 32 GB 1.8" SSD drive at CES 2007.The XO-1, developed by theOne Laptop Per Child (OLPC) association, uses flash memory rather than a hard drive. As of June 2007, a South Korean company called Mtron claims the fastest SSD with sequential read/write speeds of 100 MB/80 MB per secondRather than entirely replacing the hard drive, hybrid techniques such as hybrid drive and ReadyBoost attempt to combine the advantages of both technologies, using flash as a high-speed cache for files on the disk that are often referenced, but rarely modified, such as application and operating system executable files. Also, Addonics has a PCI adapter for 4 CF cards, creating a RAID-able array of solid-state storage that is much cheaper than the hardwired-chips PCI card kind.The ASUS Eee PC uses a flash-based SSD of 2GB to 20GB, depending on model. The Apple Inc. Macbook Air has the option to upgrade the standard hard drive to a 64GB Solid State hard drive. The Lenovo ThinkPad X300 also features a built-in 64GB Solid

Leading Manufactures

  1. http://www.numonyx.com/
  2. http://www.st.com/stonline/products/families/memories/memory/index.htm
  3. http://www.samsung.com/global/business/semiconductor/products/flash/
  4. http://www.micron.com/